5G is starting to appear in mid-range mobile chips: after a Kirin 990 launched last year in the Mate 30 Pro and integrated into the new batch of P40s in its 5G version, Huawei is launching the Kirin 820. Developed by Huawei's semiconductor subsidiary, HiSilicon, this chip remains engraved in 7 nm like the previous Kirin 810. And incorporates the same 5G modem as the Kirin 990, directly within it – so it is not an external chip .
The Kirin 820 still relies on Cortex A76 (powerful) and A55 (energy efficient) cores but the combination is different from that of the Kirin 810. Rather than using two A76 and six A55, the “team” is organized around an A76 “gold” core clocked at 2.36 GHz to quickly execute single thread tasks, three other A76 cores at 2.2 GHz and four A55 cores at 1.84 GHz. By replacing two A55s with two A76s and changing the operating structure of the chips, HiSilicon claims up to 27% more performance compared to the previous generation.
On the graphics side, exit the Mali-G52 and hello the Mali-G57, a six-core GPU that would deploy up to 38% more performance. On the AI acceleration side, Huawei / HiSilicon talks about an NPU that would integrate a “big heart” without giving more details, except that its performance would be 73% higher than that of the Kirin 810. On the imaging side, the Kirin 820 receives the 5e generation of HiSilicon's image processor (ISP), the Kirin ISP 5.0. A component capable of shooting 4K video at 60 frames per second and which incorporates a new digital noise reduction engine.
The first terminal to integrate the chip will be the future Honor 30S freshly announced on the Chinese market. History will tell whether the terminal will be released – or not – in Europe.
Source: XDA Developpers